We are manufacturing PWBs using SMD, PTH, and Mixed Technology. Run rates are relatively high and cycle time of product flow is relatively fast. Boards range from double sided (minimal) to multilayer (most) in single, half panel, and full panel configuration. Some PWBs, obviously see IR, some flow solder, and some mixed technology both IR and flow solder. Some parts are commercialized some MIL spec. Our plant environment is somewhat controlled (air conditioned). Humidity is not high, yet somewhat humidity controlled (ESD reasons). We are currently observing no adverse affects at IR as a result of not baking PWBs prior to IR. We are considering eliminating pre-wave bake. The question is "What experience can you share from eliminating your bake cycle at pre-wave." Positive and negative will be well accepted and appreciated.