>----- Forwarded message (MIKE CUSACK <[log in to unmask]>) -----< * New Engineering Position * May 7, 1996 Multichip Package Engineering Position AMI Multichip Products Division Duties and Responsibilities 1. Devise multichip packaging solutions and create circuit layouts, employing standard MCM subcontract manufacturing processes, materials, design rules, and methodologies. 2. Interface with all internal groups, vendors, and customers regarding multichip packaging of bare silicon die and packaged microelectronic components. 3. Document designs, receive, convert, and transfer electronic files to/from customers and suppliers. 4. Create, track, and report project progress. Minimum Qualifications Eng 1 - BS degree in Electrical Engineering plus 0 - 1 year of course work or experience in layout, design, or assembly manufacturing of electronic systems. Eng 2 - BS degree in Electrical Engineering plus 1-3 years of directly related experience in layout, design, or assembly manufacturing of electronic systems. Experience Desired 1. Understanding of CAD layout tools, such as AutoCAD or Mentor MCM Station. 2. Experience with personal computer software tools, networking, and file transfer protocol and conversions. 3. Experience with use of electronic semiconductor and discrete components in a system environment. 4. Working experience with printed circuit board or hybrid assemblies. 5. Subcontractor qualification/administration experience. 6. Comfortable with telephone and written communication. For more information, contact: Mike Cusack AMERICAN MICROSYSTEMS, INC. Multichip Products Division 2300 Buckskin Road Pocatello, Idaho 83201 Tel: 208-234-6607 FAX: 208-234-6695 e-mail: [log in to unmask]