Remembering from a prior life, we used to do 5 solder shocks, standard Mil-P-55110C (the revision in force at the time) sample conditioning and preparation. The solder shock was a float at 550 deg.F. for 10 seconds. Product used was random selection from what was being manufactured on the floor at the time. This regimen was used as a process control and was done daily. If the process did not pass 3 or more solder shocks, we would react and go start looking at the contributing process variables (i.e. copper bath condition, laminates used, Z-Axis, ductility, elongation, baking processes etc.). The actual product reject criteria, however, still remained that the product had to pass 1 solder shock, as in the military specification pertaining at the time. Hope this helps. Greg Schroeder [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: In-process Test coupons Author: [log in to unmask] at SMTPLINK-HADCO Date: 5/8/96 8:36 PM Does anybody pull coupons immediately after pattern plate and solder float the coupons as an inprocess check? If so how many floats and at what temperature: the usual 550F? If mutiple floats are used what reject criteria is used?