======== Original Message ======== Sender: [log in to unmask] Received: from simon.ipc.org (IPC.ORG [168.113.24.64]) by arl-img-5.compuserve.com (8.6.10/5.950515) id UAA20089; Wed, 8 May 1996 20:49:25 -0400 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id TAA11176; Wed, 8 May 1996 19:49:22 -0700 Resent-Date: Wed, 8 May 1996 19:49:22 -0700 Received: by ipc.org (Smail3.1.28.1 #2) id m0uHIWN-0000FuC; Wed, 8 May 96 18:19 CDT Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> From: [log in to unmask] Message-Id: <[log in to unmask]> Date: Wed, 8 May 96 18:22 EST X-Sender: [log in to unmask] (Unverified) X-Mailer: Windows Eudora Light Version 1.5.2 Mime-Version: 1.0 Content-Type: text/plain; charset="us-ascii" To: [log in to unmask] Subject: In-process Test coupons Resent-Message-ID: <"WmmnM1.0.eIF.LmIan"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/3958 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] Does anybody pull coupons immediately after pattern plate and solder float the coupons as an inprocess check? If so how many floats and at what temperature: the usual 550F? If mutiple floats are used what reject criteria is used? ======== Fwd by: Tony King / N ======== Testing at pattern plate for thermal integrity is not the preferred location, what is the intent of this test ? Thermal testing of this nature should be performed after the final heat cycle within the manufacturing process, typically after hot air solder level. Thermal test should be used as an indicator of product integrity after thermal cycling through assembly, the product after pattern plate is not a representitive sample of the product as shipped. Tony King Elexsys International 603-886-0066