to Kevin, Groovy et al I guess we kinda got off track on the nailhead problem and voids that may be created because of.nailheads. I think that most of us think of wedge-voids as voids appearing along the oxide line and hole wall interface. It seems that wedge-voids can be present regardless of nailheading or no nailheading, regardless of the type of direct plate or even with electroless copper; though with electroless copper they are usually filled with electroless and electrolytic copper in the finished board. Some people do not accept these wedge like appearances even when filled with electroless copper and electrolytic copper and scrap the boards, IPC-RB-276 accepts this appearance, but other specs are silent on the subject which allows some to make up new rejectable defects and scrap the product. Phil Hinton Hinton "PWB" Engineering [log in to unmask]