To Whom... We locate a ,100 dia grounded pad somewhere in each corner of the pwb. If restricted, we will locate a min. of 2 pads diagonally placed. The pad is a surface pad only with a surface trace connecting it to an internal ground plane, requested by our assembly/test community.For fine pitch microcircuits, we locate a non-grounded surface pad within the component outline, on a diagonial. For uniformity, we will include the pads as part of our footprint definition(land pattern). We worked with our test/manuf people to determine what was needed and how to implement it into our designs which are mainly high density, multilayer, SMT surfaces (components both side). Again, work with those people that are requesting fiducial to solve all of their requirements without sacrificing too much land area. If you need more info, please feel free to contact me. Hope this helps. 203-852-4810 Bob Vanech