We have been using the "Shadow" process in the manufacturing of multilayer and double-sided, polyimide, epoxy and teflon boards since the beginning of 1995. The process is working very well for us. There was definitely some process tuning that took place prior to implementation and then optimization occurred throughout the year. Care needs to be taken with processes leading up to "SHADOW". Drills, repoints, # of hits, how rough the hole is; desmear (we plasma and vapor hone), degree of etchback, again how rough the hole is; are the types of things which need to be considered. Aspect ratios, and hole sizes of the product being run are also necessary to consider. Just like any new process the three ingredients, the process engineer, the chemistry and the equipment supplier, have to mesh well for a successful process implementation. It did at our facility, we took out our electroless line in April of 95. Customer education was important. Once they realized the quality of a direct metalized interconnect they moved from skeptic to advocate. It's definitely a proven, viable process. I'll discuss it in more detail if you like. Neal Preimesberger Hughes Missile System Co., Tucson AZ 602-794-1030 or direct: [log in to unmask] We have learned much about this new process, too much to put down in print on an E-mail. Please feel free to give me a call if you care to discuss this process.