Hello: I find that the tightest tolerance suggested in IPC-D-275 for bow and twist is 0.5% for multilayer boards. Our fabricator had great success to develop a process and produced five parts less than 0.25%. Generally, our cards are 6 by 9, and .063 to .093 thick. Do any assemblers find it necessary to specify this requirement less that .5% to automate the pick-N-place process? Thank you in advance, and waiting for a Minnesota summer (I may have to wait until next year), Kevin Thorson Lockheed Martin