In respone to inquiry as to whether multilple HASL dips to inprove coverage of lands. Whenever the board undergoes HASL, the copper thickness decreases by 0.00007 to 0.0003 inch per dip. The quicker the dip the small the amount of copper goiing into solution. As many of you have seen, there may be complete a copper washout, hole voiding and barrel cracking after 3 dips, and for some HASLers after 2 dips. A look at the microsection after multilple solder dips is a necessity and should be part of any process control system that allows multiple-HASL's. Phil Hinton Hinton PWB Eng