Chris- Sonoscan is known for its acoustic microscopy imaging systems, which are useful for examining plastic encapsulated semiconductor packages for voids, delamination, etc., due to "popcorning" damage, die bond failures, etc. Per NEPCON West '96 Buyers Guide: Sonoscan, Inc. 530 East Green Street Bensenville, IL 60106 708-766-7088 I have a paper which describes the principle of operation and the application of Sonoscan "C-SAM" equipment, "An Evaluation of Acoustic Microscopy (for nondestructive inspection of PEMs, MCMs, etc.)", by Allen Hawes of the Naval Surface Warfare Center at Crane, presented at the 1995 Advanced Technology, Acquisition, Qualification, and Reliability Workshop here in Southern California last August. Contact me if you want a copy faxed to you. Also, the cover story on SMT Magazine, May 1995, discusses SAM in the assessment of popcorning on plastic QFP. Regards, Michael S. Alderete Sr. R & D Engineer Lockheed Martin (formerly Loral), Aeronutronic Division 29947 Avenida De Las Banderas Rancho Santa Margarita, CA 92688 (714)459-3190FAX email: [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: Re:Sonascan Author: [log in to unmask] at _internet Date: 4/24/96 2:48 PM Hello, I am looking for any information available on a technology available called, "Sonascan". It is a type of inspection for Ball Grid Arrays (BGAs). Any information at all would be appreciated... Thank You, C. Piasky [log in to unmask]