HI ! I am writing a chapter for a book 'Failure modes and Mecahnisms in Electronics Packaging'. This chapter deals with what suppliers and their customers find on the product returned from the field due to malfunction or a suspected failure. The data is being organised as follows: Failure Mode Mother Board Adapter Cards Memory Cards ------------------------------------- ---------------------- ------------------------ ------------------------ 1. No defect Found % or ppm % ppm % or ppm (Retest OK) 2. PCB related - Shorts - Opens - Corrosion - migration 3. Solder Joints (SM) (opens) 4. Solder Joints (PIH) (opens) 5. Components(Active) - ESD - Wire Bonds - Corrosion - Migration - Electrical Overstress - Thermal Stress 6. Components (Passive) - Solder Joints(opens) - Electrical Short - Electrical Open 7. Connectors - No Defect Found - Intermittent - Corrosion - Metallurgy - Mechanical The data can be as % or ppm. A generic pareto data format is useful for this type of discussion and no source will be identified with a particular data set. Each source will be greatfully acknowledged by the authors. Thank You for your help.