The HDP users group, telecom working group (which includes Alcatel - and virtually every other telecom company) is working the Ni-Pd lead finish issue. The suppliers represented include TI, AMD, National, Motorola, Amkor/Anam and others - so this issue is likely to become much more widespread. I recommend that items/issue related to this lead finish be sent to Reuben Bergman (e-mail: [log in to unmask]) for coordination to the entire working group. For reference the Alcatel rep on the Pd issue is Nic De Roose. Joe Smetana DSC Communications "All opinions expressed are solely my own and do not necessarily reflect the opinions of DSC Communications." ______________________________ Forward Header __________________________________ Subject: ASSY: SOIC'S IN WAVESOLDERING (fwd) Author: GEILAND at DSC-1100 Date: 4/9/96 11:41 AM Joe: FYI. Looks like something you discussed a couple of months ago. GE ______________________________ Forward Header __________________________________ Subject: ASSY: SOIC'S IN WAVESOLDERING (fwd) Author: [log in to unmask] at SMTPLINK Date: 4/9/96 11:36 AM Forwarded to TechNet for Assistance Thanks Dave Bergman, IPC ---------- Forwarded message ---------- Date: Tue, 09 Apr 1996 13:36:48 +0100 (MET) From: EDDIE VAN HOREN 014 57 20 08 <[log in to unmask]> To: [log in to unmask] Subject: SOIC'S IN WAVESOLDERING David, I'm looking for help somewhere in the industry on a serious soldering problem. Is there something like a bulletin board where items can be posted for discussion? Today's problem in a nutshell : Subject : wavesoldering of SO-components (mainly SOIC). Since a few years, Texas Instruments has changed the lead finish of the SOIC's to a layer of nickel with a palladium flash (simplified). This can result in 1000 ppm open solder joints when wave soldering. In the very near future, starting next june, Motorola is also switching to a simular leadfinish. All others are expected to follow soon. In the farther future, useing other PCB finishes than SnPb ( NiAu, preservated Cu etc.) will undoubtedly increase the problem. I see this as a tremendous problem for those people who are wavesoldering this kind of components. Is there a way to find out whether this problem is recognized by users, and if somebody sees a solution to the problem ? And again, is there a way to put questions to the IPC community? Best regards. Eddie Eddie Van Horen Industrial Engineer Alcatel Telecom Belgium Bell Telephonelaan 2 2440 Geel Belgium Tel (32) 14 57 20 08 Fax (32) 3 240 48 02 E-mail : [log in to unmask]