Mail*Link(r) SMTP FWD>DES & FAB Large Conductive Areas Kenny -- if at all possible break them up, don't let you designers get away with it. Generally with most packaging densities there are enough holes and openings in the planes to break up the large areas of solid Cu. We do some designs with wide, 70 micrometer (2 oz/sqft) Cu, internal, high-current conductors at assembly. We've had one that failed due to power cycling (operating). Yes design it right -- break them up. Ralph Hersey Lawrence Livermore National Laboratory e-mail: [log in to unmask] -------------------------------------- Date: 3/29/96 4:35 PM From: Kenny Bloomquist We are struggling with the interpretation of IPC-D-275 paragraph 5.3.1.5. One group is arguing that this paragraph discussing cross-hatched areas only applies to external layers and the other group feels that it should apply to all layers. What say gang? ------------------ RFC822 Header Follows ------------------ Received: by quickmail.llnl.gov with SMTP;29 Mar 1996 16:35:01 -0800 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id SAA28606; Fri, 29 Mar 1996 18:30:53 -0800 Resent-Date: Fri, 29 Mar 1996 18:30:53 -0800 Received: by ipc.org (Smail3.1.28.1 #2) id m0u2k1a-0000DOC; Fri, 29 Mar 96 13:39 CST Resent-Sender: [log in to unmask] Old-Return-Path: <[log in to unmask]> Message-Id: <[log in to unmask]> X-Sender: [log in to unmask] X-Mailer: Windows Eudora Version 1.4.4 Mime-Version: 1.0 Content-Type: text/plain; charset="us-ascii" Date: Fri, 29 Mar 1996 11:43:19 -0800 To: [log in to unmask] From: [log in to unmask] (Kenny Bloomquist) Subject: Large Conductive Areas Resent-Message-ID: <"rLTq92.0.5CA._n3Nn"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/3212 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask]