Two Questions: 1. Has anyone any suggestable downsides or advantages to a manufacturing procedure called EBP (etch before plating) technology. 2. Also Has anyone used PCBs with a base material CEM33. How does it differ from other types of material (CEM-1, FR4 etc.) in relation to temperature tolerances/variations, pad adhesion etc.? Thanks, Martin Dooner AMT Ireland University of Limerick Ireland [log in to unmask]