Two Questions:

1. Has anyone any suggestable downsides or advantages to a manufacturing 
procedure called EBP (etch before plating) technology.

2. Also Has anyone used PCBs with a base material CEM33. How does it differ 
from other types of material (CEM-1, FR4 etc.) in relation to temperature 
tolerances/variations, pad adhesion etc.?

Thanks,

Martin Dooner
AMT Ireland
University of Limerick
Ireland

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