Good morning: Rockwell recently qualified 348 and 3609 for a variety of chipbonding applications. Whether the cognizent engineers can share much in the way of specifics is not known to me, but I've forwarded your message. The outgassing data on those products is available from Loctite tech service (either the Electronics group in Detroit, or from the factory where those products originate in Ireland). Marc Carter Application Engineer Rockwell CACD ______________________________ Reply Separator _________________________________ Subject: Chip bonding info Author: [log in to unmask] at ccmgw1 Date: 3/27/96 8:52 AM Does anybody have information and or studies done on bonding glass bodied chip with chip bonding material such a loctite 3609 for wave soldering. Also looking for out-gasing data on any material that could be used for space applications. Hector Valladares Honeywell Space systems Principle SMT Engineer 813-539-3683 voice [log in to unmask]