I am looking for guidelines for designing a wave soldering fixture to selectively solder thru-hole components. The circuit board is double sided smt with thru-hole on the primary side. We are currently reflowing both smt sides and manually soldering in the thru-hole. We would like to selectively solder the thru-hole solder joints through wave. The board is 0.062" thick with the tallest smt component on the bottom side being 0.080". Questions that pop to my mind are: 1) what material do I use as the barrier 2) what minimum material thickness do I need to prevent material warpage over repeated heat cycles 3) what minimum opening size is acceptable to allow solder to flow up to the circuit board 4) would using the chip wave help Any suggestions are appreciated. Peter Wong Axiom Electronics 503-643-6600