Trace width is typically not a reliability issue, particularly after assembly. If your assemblies have survived yhe assembliy processes (solder reflow temperature excursions) without post separations, your thin trace width do not have a reliability down-side, if as you indicate the lines are adequate for both current carrying capacity. Why do you ask about a temperature range of -55C to 125C? That temperature range exists only in test chambers and should NEVER be used for full assemblies because you seriously damage, possibly destroy, your good solder attachments. Werner Engelmaier *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************