Dear Technetters: We manufacture boards used in particularly harsh environments and we're working to convert the fabricated boards to SMOBC from solder mask over fused tin/lead. What data or documents are avalable to support the reliability of a conversion from solder mask over fused tin/lead to SMOBC? (MIL-Specs, OEMs that have already converted, etc). Thanks in anticipation of response, Jim Noble Printed Circuit Corporation *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************