Dear Technetters:

We manufacture boards used in particularly harsh environments and we're
working to convert the fabricated boards to SMOBC from solder mask over fused
tin/lead.

What data or documents are avalable to support the reliability of a
conversion from solder mask over fused tin/lead to SMOBC?  (MIL-Specs, OEMs
that have already converted, etc).

Thanks in anticipation of response, 

Jim Noble
Printed Circuit Corporation

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************