TechNet, Searching for comprehensive packaging guidelines, procedures, standards, handbook, etc. for shipping/handling/transportation of electronic components (DIP's, SMD's, etc.). Are their generally accepted practices (ASTM, IPC, MIL, etc)for packaging and materials methods used in providing optimum protection to the product (physical support and transportation hazards such as ESD) ? D.Drake *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************