I have been discussing with IPC the possibility of producing a document covering X Ray Inspection of solder joints including criteria, X Ray methods and ways in which the inspection method can be enhanced using pad designs. David Bergman has asked me to ask members of Technet who would like to contribute to a document to contact me directly so that I can product a working group for the project. As some of you may be aware I have circulated my first attempt at a reference standard on Technet before. I would like together with IPC produce a document which would be helpful to industry. Shortly there will be a section featured in the IPC News covering the production of a draft document view Email. Face to Face discussions may be possible at Nepcon West to further move the project along. If you would like to be involved in writing a document please send me a mail direct with your name, Tel, Fax, Email and company mailing address and details of any existing company document you may have so that I can circulate existing material for comment and discussion. Bob Willis (Vice President of the SMART Group) Process Engineering Consultant Electronic Presentation Services 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. Tel: (44) 01245 351502 Fax: (44) 01245 496123 Home Page: http://ourworld.compuserve.com/homepages/Bwillis Email: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************