Greg Bartlett's advice is good. He did not mention, that it is best to collect data from a significant sample size (25+) to get the mean from a distribution. He is also correct in stating, that "this kind of test [cannot be used] as a means of predicting reliability". It needs to be said however, that if your pull test results are below what that should be, reliability will be less than expected because you are likely having inadequate wetting of your solder joints. But the reliability of good solder joints depends on design parameters and the severity of the operating environment. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 201-543-2747 E-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************