One of our PCB suppliers is going to substitute the Blackhole through hole metallization process for their conventional electroless copper process. This supplier provides us with 4 to 10 layer boards, some of which have vias 0.010" in diameter. This is a relatively new process. Supplier sponsored lab test reports are available which show favorable results. Something that I have not yet found are fabricators or end users of boards made with this process. I would appreciate hearing from people who have: (a) assembled PCBs made with this process into their product and have some assemblies out in the field, or have done life tests on these assemblies, or (b) fabricated boards using this process and know from experience the robustness of this metallization process. Vic Beldavs [log in to unmask]