Steve, You missed one by saying: "1. First thing, all yer' tryin to do is somehow secure components on the bottom of a PCB so you can wave them along with the thru-hole, nothing more. The adhesive isn't adding any mechanical strength, or anything else to the soldered connection" with regards to gluing components down. While of course, as you correctly state "the adhesive isn't adding any mechanical strength", you kissed the mark with "or anything else to the soldered connection". Adhesive that has a higher CTE than solder (not much of a problem) will lift the component during the soldering process away from the PWB. That increases the solder joint height and therefore the reliability of the solder attachment, everything else being equal. Further, on cooling the solder solidifies, than both the solder and the adhesive contract. But since the adhesive contracts at a faster rate (higher CTE) than the solder, it puts the solder joints in compression. In many cases not very much, mind you, but some. That also tends to increase solder joint reliability. So be careful with sweeping "or anything else's". Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 201-543-2747 E-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************