With my previous work developing rework processes for ceramic BGAs (1st level package rework, not card rework), I played around with inverting the BGA at temps of 200C while securing the 90/10 balls in hopes of separating the two. I found that even inverted you still had to apply a significant amount of force to separate them. The surface tension effects of the molten eutectic solder were quite large, enough to support a heavy CBGA inverted. If you are using a PBGA, they should be able to undergo a 2nd reflow inverted without any harm. In fact you will elongate the joints some, making them even more reliable (never thought you would see a bonus of a second reflow!). The question is how far are you from the cliff when you include belt vibration and other factors. It may be worth experimenting with rather than having to use epoxy to glue component down. Don Foster Symbios Logic *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************