---------------------------- Forwarded with Changes --------------------------- From: lmendoza::(LMENDZ) at ~FABRIK Date: 12/6/96 5:22PM *To: TECHNT at ~FABRIK Subject: ASSY: Chip on Flex ------------------------------------------------------------------------------- If you're going to wire bond the chip to the flex and then encapsulate, be careful to use either an adhesiveless flex laminate material or one with a high modulus adhesive like pehnolic:butyral. This reduces the parasitic absorption of bonding energy by soft adhesives like acrylic and helps keep the flex pads from squirming around during bonding. Andy Magee - Applications Engineer Rogers - Circuit Materials Tel: (602) 917-5237 Fax: (602) 917-5256 E-Mail: [log in to unmask] Website: http//www.rogers-corp.com/cmu //////////////////////////// // SERVICE TO THE LINE, // // ON THE LINE, // // ON TIME. // //////////////////////////// ______________________________ Forward Header __________________________________ Subject: ASSY: Chip on Flex Author: lmendoza::(LMENDZ) at ~FABRIK Date: 12/6/96 5:22 PM From: [log in to unmask] Date: Fri, Dec 6, 1996 5:22 PM Subject: ASSY: Chip on Flex To: TechNet I am investigating the chip-on-flex process for a new product that our company will be doing. I would appreciate if anybody could share some of their "live" experiences with this technology, the issues involved with this technology. Best regards, Luke Mendoza Electronic Assemblies, Inc. -- Luke Mendoza - http://iphil.net/~lmendoza, http://www.users.irf.ph.net/~lbm 1--> No man can serve two masters, yes-men can serve hundreds. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************