We use some MELFs in high volume (day job). We hate them and are designing
them out even if it means thru-hole. That said you might try a drop-of-glue
(extra step - cost impact)to help hold the package onto the IPC footprint
without notches (we found the notched footprint didn't help any!). Will you
wave or 2-side reflow (it do make a difference, though the glue thing works
with both)?
FNKEC

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