For CAF information see Engelmaier, W., and L. Turbini, "Design for Reliability in Advanced Electronic Packaging," Proc. Surface Mount International Conf., San Jose, CA, August 1995, pp. 844-879, which also contains the most important references. The same information is included in IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies'. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 201-543-2747 E-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************