There is a new rigid board spec issued by IPC. The new Specification is IPC-6012 which is a replacement for IPC-RB-276. There is also an accompanying generic spec. IPC-6011 which covers some of the qualification, dimensioning, SPC etc which was originally in IPC-RB-276. There is to be an article written by Bob Neves ( Microtech Labs) in his monthly article (January, I think) in Circuit Tree which explains the new specifcation and also its relation to the generic spec. The other specs which are following that will use the IPC-6011 generic spec are the Flex Spec, PCMCIA spec. and the MCM spec. The number are IPC-6013, 6014 and 6015 The new rigid board spec (IPC-6012) has some new ideas on testing and acceptance criteria, but does not cover acceptance criteria for such things as landless holes, vias in SMT and BGA lands, filled blind vias, blind via interconnects etc., reinforcementless layers for blind vias and photoimagable dielectric that remains in the board. Would like some input as to whether the above should be included in the rigid, flex, PCMCIA and MCM specs. or shoud these be broken out into a separate spec(s) that addresses these technologies only. Phil Hinton [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************