>From what you have said it is is the solder paste in the holes causing the outgassing and the voiding which does happen with via hole mounting due to restriction of solvent evaporation from the holes. The Entek is not relevant to the problem you describe. If it were the boards then use the outgassing test I have talked and posted on the Technet many times. My outgassing test video also shows how to test boards. I have been doing via hole mounting and if you get the profile correct you do not get gassing. Bob Willis Process Engineering Consultant Electronic Presentation Services 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. Tel: (44) 01245 351502 Fax: (44) 01245 496123 Home Page: http://ourworld.compuserve.com/homepages/Bwillis Email: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************