Subject: Time: 10:16 AM OFFICE MEMO RE>ADMIN: Poll Results on Splitting... Date: 2/29/96 Melinda's poll to "carve-up" the technet seems to have met with good success. I'm glad the proposal is to add an introductory protocol to identify the contents of the request. >From Melinda's poll results summary the following was proposed: 1. Implement a protocol whereby the Subject of each submission to the TechNet forum begins with FAB: If it has to do with fabrication, ASSY: If it has to do with assembly, DES: If it has to do with design, or ADMIN: If it is from one of our mail list administrators, as this message is ------------------ As an alternative, you might consider: Technet is involved in more electronic packaging than printed boards. I've been using a subject index filling system code for several years that is technology, process based, and allows the addition of sub-descriptors for additional information, such as through-hole technolgy, surface mount, chip-on-board, etc. The following is a sample: PBD -- printed board design PB -- printed board manufacturing PBA -- printed board assemblies MCMD -- multichip module design MCM -- MCM manufacturing MCMA -- MCM assembly EA's are the next level of electronic packaging and may contain PBA(s), MCM(s) and include all kinds of hardware, such as chassis, metal frames, etc. EAD -- electronic assembly design EA -- electronic assemblies Some of the sub-descriptors are BM (base material), CP (conductive patterns), E (electrical characteristics), T (thermal), M (mechanical) SMC, BGA, WB (wire-bond), TAB, etc. Ralph Hersey Lawrence Livermore National Laboratory Phn: 510.422.7430 FAX: 510.424.6886 e-mail: [log in to unmask]