Whomever... We are looking at a new product to be designed/fabricated with either IPC class 2 or class 3 requirements. Our design parameters, which as still negotiable, are as follows: O 14 layer, .085 thick VME type board O 1 oz. copper (5-6 planes/8-9 signal) O mixed tech (560 pin pgas on .1 x .05 mil staggered pitch/299 pin pgas on .1 mil pitch/304 pin quad flat packs on .02 mil pitch/100 pin quad flat packs on .025 pitch, etc, etc, etc) O .005 trace/space O .010 nominal dia via in .025 mil pad. What comments/criticisms/suggestions would the design/fabrication community make to help ensure produciblity and keep the cost reasonable?? Thanks in advance. Bob Vanech Northrop Grumman Norden Systems Norwalk ct (203) 852-4810 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************