I am working with a design that requires CTE management for solderjoint fatigue of a leadless ceramic component, and I am considering random fiber aramid pwb construction. The problem I have is that the solder side copper heat sink modulus is almost 10X that of the pwb and the results of the composite heat sink assembly is of little benefit of CTE the component sees. Can anyone recommend a heat sink/pwb adhesive that is forgiving enough to allow the expansion differences while still having good properties of shear/peel strength and thermally conductive? Thank You in Advance, Kevin Thorson