My company, like all others, is striving for zero defects in circuit board assembly and in what is shipped to our customer. We are a medium volume shop, three lines, producing 10,000bds per day for the big Three. We are using well known equipment, MPM printers, Camalot/Universal gluers, Fuji highspeed chip shooters, Electrovert ovens, and Electrovert/Seho wave solders(Seho are full tunnel), and Teradyne inline BON. All products are EOL tested. We know that machine maintenance and operator training are major factors in reducing the defect rate, and programs are presently being put in place to address these areas. We are curious where others have "process inspection steps" and the frequency they are performed. For example: Solder paste height inspection Glue dot inspection Inspect after reflow/glue cure(100% or audit?) Inspect after wave solder(100% or audit?) Thru-hole insertion inspection BON testing Any other inspections Your answers will be appreciated. Depending upon the responses, I will issue a summary in the near future E. Holton [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************