There is nothing magic about high operating temperatures of solder joints--only the creep rates are faster and the delta-T's are likely larger. The reliability of the solder attachments is governed by the component size, delta-CTE, delta-T, solder joint height or lead compliancy, cyclic dwell times, mean cyclic temperature, the design life, and the allowable failure probability. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 USA Phone & Fax: 201-543-2747 E-Mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************