The attributes we monitor in SPC'ing our wave solder process are bridges, blow holes, icicles, insuf. top and bottom, excess, pin holes, protrusion, and grainy solder. The first, middle and last boards of most runs are SPC'd, and the number of defects compared to the Maximum In-Control Defects ( MICD) for that particular part number. The operator stops the process any time the MICD is exceeded, for correction of the process. The MICD for each part number is computer-calculated, and the charts are also generated by VAX computer. We get charts of dpm, q index, a Pareto, and a data table. I can provide copies of these charts and/or a copy of the Statistical Process Control Instruction for this process. Lynn Roberts 817/234-6914 fax 817/234-6735 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************