We have an application were we need to bond a small heatsink to the top of a plastic packaged device (bonding area is approx 1.0" x 0.5"). We are undecided whether we should use a self adhesive thermally conductive sheet material to bond the two together, or use a thermal bonding compound (liquid adhesive). Due to the size and implementation, mechanical methods of securing the heatsink are not suitable. Any advice or experiences people have had with either or both of the two methods would be appreciated Ron Wedemeyer Senior Engineer - Product Engineering QPSX Communications Pty Ltd [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************