Looking to find out how much a standard LPI (epoxy) soldermask inhibits the transfer of heat from a hot IC to a ground plane under this IC. Can anyone out there tell me whether it would be better to leave this ground unmasked? Thanks in advance. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************