Reply to: RE>BGA Doug: I don't see it as a fabricator issue, except maybe for flatness of the pads for the balls. The pitch of the BGA contacts is less than that of fine-pitch SMT and solder mask can easily fit between the pads on the PCB for a solder "dam". Placement augmentation due to high HASL deposition should be considered. It is the DESIGNER that must route traces to the BGA package, even to the inner balls of the IC. It might involve vias to inner layers and zig-zag traces to get the inner signals to the other components on the PCA. It is the ASSEMBLER that must address the process of placing and soldering the BGA package(s) to the PCB. It MIGHT involve X-ray inspection to assure complete attachment of the inside balls, since they cannot be visually inspected. Weigh all of your options before you choose BGAs for your designs. Once committed, there is a considerable investment to be made by your assembly facility (if they don't already have it) to deal with it and inspect for the quality of that assembly. Bill Fabry Truevision [log in to unmask] -------------------------------------- Date: 1/10/96 5:37 PM To: Bill Fabry From: MR DOUGLAS C JEFFERY -- [ From: Doug Jeffery * EMC.Ver #2.10P ] -- Question? What does BGA technology mean to board fabricators? Do we have to become solder paste experts and reflow solder again.. I thought we got rid of that problem.....:).... No Seriously, what are the responsibilities at fabrication for creating boards to accept BGA's? Thanks? Doug Jeffery Electrotek.. ------------------ RFC822 Header Follows ------------------ Received: by rainbow.rasterops.com with SMTP;10 Jan 1996 17:37:19 -0800 Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI) id RAA07663; Wed, 10 Jan 1996 17:14:15 -0800 Resent-Date: Wed, 10 Jan 1996 17:14:15 -0800 Received: by ipc.org (Smail3.1.28.1 #2) id m0taBFQ-0000O1C; Wed, 10 Jan 96 18:52 CST Old-Return-Path: <[log in to unmask]> Date: Wed, 10 Jan 1996 19:52:03 EST From: [log in to unmask] (MR DOUGLAS C JEFFERY) X-Mailer: PRODIGY Services Company Internet mailer [PIM 3.2-334.50] Message-Id: <[log in to unmask]> To: [log in to unmask] Subject: BGA Resent-Message-ID: <"HSR4P3.0._E7.py5zm"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/2200 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask]