Hi Jim - Have you ever noticed that specifications and technology just don't track together very well! The solderability of BGA components is a good instance of this fact. The ANSIJ-STD-002 doesn't specifically exclude the solderability testing of BGAs but the methods don't fit very well. One consideration is what solder sphere metallurgy do you have - 63/37 or 90/10 solder alloy? The 90/10 would allow you to do some solder dipping. My suggestion is to do a simulated surface mount test - this test will be in the next revision of the 002 spec but isn't in the current rev. The test amounts to stenciling a solder paste deposit that matches the component footprint on a nonsolderable substrate (PTFE, ceramic,etc), placing the component, running it through a reflow process, cleaning and inspecting for 95% wetting. This testing would satisfy both the solderability concerns and the 001B question. As for your oxide question - it shouldn't be any different than other components if the solder alloy is the same. Good Luck. Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: ASSY: BGA SOLDERABILITY Author: [log in to unmask] at ccmgw1 Date: 11/14/96 2:51 PM --Boundary (ID WD46Z5QMtVfk8Vv9Y948UA) Content-type: TEXT/PLAIN; CHARSET=US-ASCII --Boundary (ID WD46Z5QMtVfk8Vv9Y948UA) Content-type: MESSAGE/RFC822 Date: Thu, 14 Nov 1996 11:44:00 EST From: "Jim Marsico"@mr.ail.com Subject: ASSY: BGA SOLDERABILITY MIME-version: 1.0 Content-type: TEXT/PLAIN; CHARSET=US-ASCII Posting-date: Wed, 13 Nov 1996 23:00:00 EST A1-type: DOCUMENT Here's a thought... Can solderability be specified for BGA components? How much oxidation would render a BGA unsolderable? How would one test for solderability on BGAs? How does one "... ensure that all components... are solderable at the start of hand and/or machine soldering operations." (J-STD-001B, para 5.4) for BGAs? Any comments? Jim Marsico (516) 595-5879 [log in to unmask] ******************************** * ______ _ _ _____ * * / ___ | | | | | _____ * * / /___| | | | | | _____ * * __/ ____ | | | | |______ * * |____/ |_| |_| |________| * * * * SYSTEMS, INC. * ******************************** --Boundary (ID WD46Z5QMtVfk8Vv9Y948UA)-- *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************