I have a mixed technology circuit board where I have leaded components on one side of the board and surface mount components on both sides. Normally, this would not be a problem as I would solder the leaded components and the "backside" surface mount parts by wavesoldering.The components on the "backside" in this case are DPAK Mosfets which I do not want to send through my wave. Therefore, I am planning to dispense solder paste and reflow this side of the board separately. I have a Camalot machine with a positive displacement pump that I can use for this purpose. My questions are: 1) What size needle and time durations would be suitable for dispensing paste. (I'm planning to use Kester 596 solder paste, SN63, 90% MC, -325/+500 Mesh). 2) Do you buy the solder paste in syringes or can you effectively fill disposable carrtridges. 3) Is my approach too cautious ?? Send the DPAK components through the wave anyway ? Thanks in advance for any reponses. Ican be reached on the "Net" or I can be e-mailed directly at [log in to unmask] . Bill Kasprzak Moog Inc. East Aurora, NY 716-652-2000 ext 2507 / Fax 716-687-4378 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************