Date : 15/11/96 17:49 Msg From: PROCESS ENGINEERING WE ARE MANUFACTURING SIMM MODULES WHICH ARE IN THE FORM OF PANELS. EACH PANEL HAS 10 SIMM MODULES( 5X2). ON AN AVERAGE WE ARE GETTING 4 TO 5 X- OUTS SIMM MODULES PER PANEL WHICH ARE NOT BEING POPULATED. WE ARE FACING THE PROBLEM OF SOLDER BALLS IN BETWEEN THE LEADS OF IC's, THIS PROBLEM IS RANDOM IN NATURE(i.e IT VARIES WITH NO. OF X- OUTS IN A PARTICULAR PANEL.). WE SUSPECT THAT THIS PROBLEM MAY BE BECAUSE OF VARIBLE THERMAL MASS IN THE PANELS. IS THERE ANY WAY OF AVOIDING THIS PROBLEM. ALSO IS THERE ANY GUIDLINE FOR THE ALLOWABLE NO. OF X - OUTS IN A PANEL THAT WILL NOT AFFECT THE THERMAL MASS OF THE PANEL SIGNIFICANTLY. REGARDS AJAY AGARWAL ALTOS INDIA LIMITED *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************