A PQFP on a FR-4 PWB does not have much of an expansion mismatch for anything but very severe applications (automotive). Also depending how the encapsulant fills the gap between component and PWB and how it is cured, it could act as an underfill like for flip-chips. W. Engelmaier *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************