We have a nitrogen storage cabinet for storage of moisture susceptible packages when they are required to be stored on the production floor for extended periods of time. A sealed package is not opened until needed for production. Baking is difficult because the parts cannot be baked in the tape/reel or the matrix trays due to solderability concerns. The nitrogen storage cabinet can also be used to remove moisture from parts(if stored improperly), but this takes several weeks. ------------- Original Text From: C=US/A=INTERNET/DDA=ID/TechNet-request(a)ipc.ipc.org, on 11/8/96 11:36 PM: What is the proper storage of SMT ICs; are there any guidelines or standards to use? If moisture absorption is a problem with plastic parts, is the standard practice to bake assemblies or parts prior to reflow? What are the baking requirements? Our in-house stores personnel won't break down the sealed outer packs as supplied by the IC manufacturers (they'll issue ICs in quantities as supplied by the IC manufacturers, approx. 100 or 200 parts each). As a result we have opened partial packs of parts remaining in the manufacturing area. Thanks. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************