Your inquiry regarding 'Paste in Hole' for mixed technologies can be addressed on two levels: (1) Reliability concerns for plated-through vias (PTVs) that only obtain a partial filling of solder during reflow, and (2) soldering through-hole components using a reflow process, rather than manual soldering. I give a one-day workshop "Design, Manufacturing and Reliability Issues of Plated-Through-Holes and Vias Through Design and Manufacturing" in which the reliability issues for PTHs and PTVs are addressed, including the effects on partially filled PTVs and the severity of manual soldering on PTHs and PTVs. If your concern is the processing of (2) above, the response from Bob Willis may address your needs. Werner Engelmaier Engelmaier Associates, Inc. Electronic Packaging, Interconnection and Reliability Consulting 23 Gunther Street Mendham, NJ 07945 Phone & Fax: 201-543-2747 E-mail: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************