Question: I need a thermally conductive adhesive to put under a QFP. I know that if I put it on prior to placement, it would screw up my alignment, soldering, etc, I plan to add a hole (.100 to .125 dia) in the PCB under the center of the part and apply the stuff after all assy is complete. The adhesive properties are not important, in fact less is better. The stuff should be viscous enough to fill the area under the part, but not run. It should be able to room temp cure in a reasonable time (2 hours or less) and not bloom out onto the plastic body of the part. Does anyone out there know of such a thing? Thanks, in advance Jim Ennis [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************