From: Stephen Ayotte EM Quality Engineering Bldg. 14-3 Col F5 5-1537 Subject: Reliability Testing Does anyone have any experience with trying to find cracks in surface circuitry on printed circuit boards. I was once told that due to copper expansion that occurs as elevated temperatures and the fact that metals shrink as lower temperatures that the preferred method for finding surface cracks that are in contact (creating continuity) is through low temperature testing. What experience has anyone had with this? Thanks. **** IBM MD Product Quality Engineer **** **** OEM Quality Engineer **** **** Interenterprise Address: USIB6CEF **** **** Internet Address: [log in to unmask] **** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************