Michael: Thanks for the info. Would you have a copy of the Motorola paper that you could fax to me? FAX: 603-337-1027. Thanks again, Ron Yanuszewski ______________________________ Reply Separator _________________________________ Subject: Re [2]: Entec 106 Author: [log in to unmask] at !INTERNET Date: 11/4/96 6:40 PM Hi Ron, Solderability: - Solderability of OSP is affected by many factors. <<Enthone- the maker of Entek should be able to answer most of your questions>> You can use J-STD-003 to test the solderability of PCB. Cleanliness - In case you have a misprint during paste application, you should make sure the cleaner chemistry compatible with your OSP. Joint Integrity - There is an interesting paper presented by Motorla at 1994 SMI Titled "Manufacturability and Reliability of Products Assembled with New PCB Finishes" by Kingshuk Banerji and Edwin Bradley Coating Thickness - Entek 106+ is about 0.2 to 0.5 microns Hope this helps Michael Yuen ---------- From: TechNet-request To: technet Subject: Re: Entec 106 Date: Monday, November 04, 1996 1:33PM Technet people: We are also in the process of switching to OSP and we are trying to set up reliability testing. What are other assemblers doing to insure product solderability, cleanliness, solder joint integrity, coating thickness,etc. Any help would be appreciated. Ron Yanuszewski Cabletron Systems ______________________________ Reply Separator _________________________________ Subject: Entec 106 Author: [log in to unmask] at !INTERNET Date: 11/4/96 12:54 PM Jeffery Harry, would you please expand on the "major problems" you have seen by running Entek 106 in a dip mode. Peter Blokhuis PC World [log in to unmask] ---------------------------------------------------------------------- If you use Entec 106, make sure that the PCB supplier has an in-line process. Dip tanks will cause major problems. Also the PCBS need to be thoroughly dried before packaging. If not, you will have solderability problems. Jeffrey_Harry @ 3mail.3com.com@ ugate ----- Previous Message ---------------------------------------------------- To: Technet @ ipc.org @ UGATE cc: From: EHolton @ vines.etn.com @ UGATE Date: Thursday October 31, 1996 02:40 PM Subject: OSP Coating ---------------------------------------------------------------------- ---------- ---------------------------------------------------------------------- ---------- ------------------------------ Fellow technetters: My company is beginning its research into the wonderful world of organic solderability preservative coatings. Our goal being to implement this on the circuit boards in the near future. I am looking for any and all information that anyone may have.... *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************