De: Coderre - JCCODERR BRMVM1 *************************************************************** CLASSIFICATION NON-CLASSIFIE ( ) CONFIDENTIEL ( ) Objet: goldfinish on PC boards Gold is highly soluble in solder and should not affect the properties of the solder joint if the concentration is below 3% (wt). This is true if the gold is completely dissolved in the solder and one does not find a rich gold concentration at the interface. THis rich zone may occur if the temperature cycle is such that the dissolution is not complete. This should be verified by SEM cross-sectioning Literature references are available upon request At higher gold concentrations (either local or bulk), embrittlement will occur Merci/Regards Directeur Ingenierie MLC / MLC ENG. MGR Dept 881/23 BRMT (tel. 514-534-6591, US tieline 552) INTERNET ADDRESS [log in to unmask] *** R(c)acheminement de la note de SMTP2 --IINUS1 11/04/96 15:05 ***