FROM: James D. Herard ************************************************************** Subject: goldfinish on PC boards Wolfgang; I don't have any specific reports I can point you to, but, it is well known that if the content of Au in a solder joint excedes about 4%, the intermetallics formed are brittle and susceptable to failure. Typically 3-5 microinches of Au is used. 30 microinches is probably way too thick for SMT, might be acceptable in some wave applications. Jim Herard IBM Microelectronics James Herard x77026 KBLE/014-3 Quality Engineer *************************************************************** ********* Get it While you Can ********************* *************************************************************** *** Forwarding note from SMTP2 --IINUS1 11/04/96 15:10 ***