FROM: James D. Herard
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Subject: goldfinish on PC boards


Wolfgang;

I don't have any specific reports I can point you to, but,

it is well known that if the content of Au in a solder joint
excedes about 4%, the intermetallics formed are brittle
and susceptable to failure.  Typically 3-5 microinches
of Au is used.  30 microinches is probably way too thick for
SMT, might be acceptable in some wave applications.

Jim Herard
IBM Microelectronics


James Herard  x77026  KBLE/014-3         Quality Engineer
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