Item Subject: cc:Mail Text As mentioned in several other messages, we have found no reliability problems associated with exposed copper on OCC assemblies. However, I have one question which I hope someone can answer: On some assemblies, we use grounded contact pads to ground shields/bulkheads, etc. The contact between the shield and the board is simply a metal tab on the shield that presses against a contact pad on the board. Is such a connection reliable if the pad is exposed copper (or copper with residual OCC after a couple of reflow cycles and an aqueous wash)as opposed to HASL? Pasting those pads is not possible in all applications due to the size, number of pads, etc. Regards, Denis Mori Hewlett-Packard Co. Roseville, CA [log in to unmask]